Nano-microporous insulation boards, with their ultra-low thermal conductivity and thin, lightweight properties, are widely used in high-temperature industrial furnaces, ladles, lithium battery packs, and aerospace equipment. Since their core insulation mechanism relies on nano-scale pore structures to trap air and suppress radiative heat transfer, performance will degrade sharply once they become damp, damaged, or improperly installed. In practical applications, nano-microporous insulation boards commonly exhibit the following issues, which require scientific identification and timely resolution.

I. Significant Decrease in Insulation Performance, Abnormal Rise in Surface Temperature

Cause Analysis:

Moisture absorption by the board: Moisture entering the nano-pores greatly increases thermal conductivity (can rise to above 0.08 W/(m·K) in wet conditions); Unsealed joints or through gaps create "thermal bridges"; Damage to the outer protective layer allows rainwater or steam to penetrate.

Solutions:

Immediately check whether the aluminum foil covering is intact, and cover damaged areas tightly with high-temperature resistant aluminum foil tape); All splicing seams and pipe penetration holes must be fully sealed with tape, with an overlap width of ≥25 mm; If severely damp, it must be removed and replaced — nano-microporous materials cannot be dried and reused.

II. Board Deformation, Bulging, or Cracking

Cause Analysis:

Excessive compression during installation (>5%), leading to internal stress release upon thermal expansion; Insufficient support structure at high temperatures, causing the board to sag; Frequent thermal cycling causing material fatigue.

Solutions:

Ensure "no pre-load contact" during reinstallation, relying only on self-weight or light fixing; Add heat-resistant stainless steel support mesh in large flat areas (spacing ≤500 mm); For equipment with frequent start-stop cycles, use flexible reinforced microporous boards (with ceramic fiber skeleton).

III. Edge Powdering or Spalling

Cause Analysis:

Cut edges not sealed, leaving fibers exposed and prone to wear; Long-term vibration or airflow erosion causing surface peeling.

Solutions:

Immediately wrap cut edges with aluminum foil tape after cutting; In areas exposed to high-velocity flue gas, cover with perforated stainless steel plate as a protective layer; Avoid repeatedly rubbing the board surface with bare hands.

IV. Poor Adhesion to Substrate (if adhesive bonding is used)

Cause Analysis:

Substrate surface has oil contamination or is not dry; Use of solvent-based ordinary adhesives that corrode the aluminum foil or release gases.

Solutions:

Only use solvent-free high-temperature silicone adhesive when necessary, with an adhesive coverage area of <30%; Prioritize mechanical fixing (such as backplate clips) to avoid large-area bonding.